Oxydol decomposer – HY 1901
PRODUCT INTRODUCTION
In the manufacturing process of semiconductors, the mixture of sulfuric acid and hydrogen peroxide (SPM) is generally used to remove residual organic matters on the wafer surface, and the resultant SPM waste liquid will produce plenty of gas due to the continuous degradation of hydrogen peroxide, which leads to the difficulty of outsourcing transportation, high disposal cost, and difficulty to be applied to other systems.
This product can remove the concentration of hydrogen peroxide in SPM waste liquid to less than 5,000 mg/L, ensure that the end product meets the recycling standard, and avoid the hazards caused by lots of gases during outsourcing transportation.
PRODUCT CHARACTERISTICS
1.High removal efficiency, the treatment limit can be as low as 10 mg/ L;
2.Less residual impurities in sulfuric acid after treatment, secondary recycling is available;
3.Less dosage of system catalyst (only hundreds of ppm dosage concentration);
4.Diversified business model: equipment, EMC, BOO/BOT, etc.
Appearance: Blue liquid
Odor: Odorless
PH:1.0~2.0
Solubility: Completely soluble in water
PACKAGING,STORAGE AND PROTECTION
25 kg/barrel
Pay attention to put it in a cool and dry place;
Avoid contact with skin, eyes and other body parts during operation, if splashed in accidentally, rinse immediately with plenty of clean water, and see a doctor in time.
METHOD OF USE
Used with the engineering system, and can be adjusted according to the field condition;
The specific dosage varies according to different water quality, and is determined based on the field condition.